PHOTONICPARTS

PHOTONICPARTS works in the field of joining and assembly technologies and production of laser components The core know-how of lies in the production of homogeneous large-area solder joints for any materials or material pairings. Major fields of application are the packaging, adjustment and thermal management of laser crystals, optics and fiber optics in the markets of laser technology, aerospace and quantum technologies.

COMPANY

PHOTONICPARTS has been founded by Dr. Jan Dolkemeyer and Phillip Dittmann in August 2023. The company based in Germany, works in the field of joining and assembly technologies and production of laser components mainly for the photonic market. Beside laser technology itself, the core know-how of PHOTONICPARTS lies in the production of homogeneous large-area solder joints for any materials or material pairings. The focus is usually on the customer's requirement for a thermally stable and robust solder joint with the lowest thermal and electrical resistance between two or more joining partners. Major fields of application are the packaging, adjustment and thermal management of laser crystals, optics and fiber optics in the markets of laser technology, aerospace and quantum technologies.

TECHNOLOGY

With PHOTONICPARTS' specialized joining and packaging technology, we can achieve an exceptionally homogeneous, long-term stable, and robust connection between the materials we use. This capability empowers us to manufacture highly robust optical components and subsystems based on soldering technology that are currently unavailable in the market.

Our extensive experience in developing and producing high-performance ultrashort pulse amplifiers and components has provided us with the expertise needed to design and fabricate optimal thermal management solutions for your system. We use PVD (Physical Vapor Deposition), sputtering and high vacuum soldering processes to enable robust solder joints that reduce thermal resistance at the heat source to an absolute minimum. These processes also allow for strain matching (CTE match) and are not constrained by specific surface geometries that require cooling.